• Company
• About Us
• Process Capability - Technology Platforms
  • Diffusion/Deposition (6")
  • Diffusion, Thin Films & Implant
  • PECVD
  • Physical Vapour Deposition
  • PVD- Fab3
  • Implant (4" & 6" capability)
  • Dry Isotropic Etch
  • Wafer Bonding
  • Plasma Etch (6")
  • Photo Lithography
  • Metrology
  • Wet Chemical Etch
  • Deep Reactive Ion Etching (DRIE)
• Quality Assurance
• Who We Work With
• Board
• Business Team

Process Capability - Technology Platforms

Semefab supports a diverse process portfolio throughout its fab operations, as is referenced within the specific wafer fab pages of MEMS volume foundry and MOS/Bipolar volume foundry.

The icons on the left illustrate the process blocks used throughout the fab operations. Clicking on specific process functions will display more detailed information about the capability presently available.

Semefab is an experienced foundry and as such we are accustomed to developing, optimising and inducting customer specific solutions in a cost effective manner.

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