• Company
• About Us
• Process Capability - Technology Platforms
  • Diffusion/Deposition (6")
  • Diffusion, Thin Films & Implant
  • PECVD
  • Physical Vapour Deposition
  • PVD- Fab3
  • Implant (4" & 6" capability)
  • Dry Isotropic Etch
  • Wafer Bonding
  • Plasma Etch (6")
  • Photo Lithography
  • Metrology
  • Wet Chemical Etch
  • Deep Reactive Ion Etching (DRIE)
• Quality Assurance
• Who We Work With
• Board
• Business Team

Metrology

• Ellipsometry for film thickness and refractive index measurement
• CD SEM
• Profileometry
• Film stress measurement
• Surfscan Particle/Defect Monitoring on blanket or Patterned wafers
• Sheet Resistance Measurement
• Metal Thickness/Resistivity measurement
• C-V and lifetime measurement
• Ellipsometry for film thickness and refractive index
• Critical dimension measurement
• White light interferometry
• Thin film stress
• Particle count
• Four point probe (silicon resistivity)
• Mgauge (metal thickness/resistivity)
• SEM with EDAX Capability for elemental analysis

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