• Company
• About Us
• Process Capability - Technology Platforms
  • Diffusion/Deposition (6")
  • Diffusion, Thin Films & Implant
  • PECVD
  • Physical Vapour Deposition
  • PVD- Fab3
  • Implant (4" & 6" capability)
  • Dry Isotropic Etch
  • Wafer Bonding
  • Plasma Etch (6")
  • Photo Lithography
  • Metrology
  • Wet Chemical Etch
  • Deep Reactive Ion Etching (DRIE)
• Quality Assurance
• Who We Work With
• Board
• Business Team

Physical Vapour Deposition

• Sputtering of Aluminium, Aluminium/Silicon, Aluminium/Copper alloys for IC and MEMS interconnect
• Gold/Ti-Tungsten sputter for Bipolar/RF interconnect and wafer backmetals for eutectic die attach
• Sichrome, Nichrome for highly stable resistors
• Evaporation of Gold, Titanium, Nickel, Platinum, Aluminium, Tin and other pure metals for MEMS interconnect, under bump metallisation, solderable pads and wafer backmetals
• Additional 2 sputtering systems (6 chambers) available for specific sputtering requirements
  • Two chambers are presently populated with Constantan and Vanadium.
  • Two chambers have reactive sputter capable with an RF Sputter etch pre clean station.

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